RDA Microelectronics RF Solutions on ICGOODFIND SiteMap
最新文章
- AMEC H1 Profit Triples to $396M – $490M Lingang Fab Expansion Underway
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- ADI Hits Record $4.02B Quarterly Revenue – Analog Chip Boom Fueled by AI Data Centers
- Cixi Technology Secures $136M Series – Edge AI Chip Startup Races for Agentic Compute
- TSMC Arizona Profit Soars 661% – US Fab Overtakes Nanjing as Top Overseas Earner
- 2026 IC Supplier Risk Matrix: Lead Time Delay & Price Hike Risk Ranking of Major Chip Vendors
- TL323X Debuts at IOTE 2026 Shenzhen – Telink’s Multi‑Protocol Wireless SoC for IoT
- 700V Half-Bridge GaN IC Cuts Motor Drive Size for 220V Variable-Frequency Home Appliances
- SK Hynix Restarts Dalian Fab 2 – 50% NAND Capacity Boost by 2027
- TSMC in Talks to Buy Two AUO Panel Fabs for $210M – Panel-Level Packaging Push
- Apple Tests CXMT DRAM for iPhone & MacBook – New Supplier in Play
- China Power Semi Player Kuaweitie Buys Jingyi for $230M – Big Goodwill, Big Bet
- Nokia Buys a Fab to Secure InP Optical Chips – Supply Play for AI Data Centers
- Five Domestic 60V Non-Synchronous Buck Converters – Automotive & Industrial Power Options Compared
- HP, ASUS, Acer Adopt CXMT DRAM in Small-Batch PC Production Amid Global Memory Shortage
- Renesas to Shut Down 6-Inch Takasaki Fab in 2–3 Years – Shifts Production to 8-Inch Lines
- Montage Tech Starts CXL 3.2 MXC Chip Trial Production – 64GT/s Memory Controller for AI Servers
- Samsung Q2 Profit Soars 1,814% to Record $64B – But Phone Business Posts First Loss Since 2009
- SK Hynix Q2 Net Margin Hits 118% – Revenue Surges 257% to $56.5B on AI Memory Boom
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Cadence Q2 Revenue Hits $1.58B – Backlog Surges to $8.1B as AI Agents Reshape Chip Design
- NVIDIA’s First U.S.-Made GB300 AI Chip Debuts – Fab21 4nm, but CoWoS Still Missing
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- Intel Q2 Revenue Soars 25% to $16.1B – Highest Growth in 15 Years
- ABB Acquires Advantics – Snaps Up SiC Power Conversion Tech for Data Centers & Microgrids
- SK Hynix Denies Intel Ohio Fab Acquisition – Both Firms Silence Rumor
- Google Locks Gemini Into Silicon with Frozen v2 – Targeting 10x Tokens per Watt
- Kimi K3 Designs a 146k-Cell Chip in 48 Hours – AI-Driven Silicon Validation
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- Intel 18A Yield Hits 85% – Apple, AMD, Nvidia Sign On; Foundry Revenue Set for 2030
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
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- MediaTek June Revenue Ticks Up 2.8% – H1 2026 Edges Down 0.8%
- Samsung Develops GAIA – 4nm AI PC Accelerator Chip Set for 2027 Mass Production
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- Onsemi BAT54CLT3G: Schottky Diode Series for High-Efficiency Circuit Design
- onsemi FAN7085M-GF085 High-Voltage Half-Bridge Gate Driver IC
- Onsemi MM5Z5V1T1G Zener Diode: Key Features and Application Circuits
- NCV1117DT18T5G: 1.8V Low-Dropout Linear Voltage Regulator LDO from onsemi
- onsemi CM1293A-04SO: High-Performance Synchronous Buck Controller for Advanced Power Management
- onsemi FODM453R2V: High-Speed 3V Logic Gate Output Optocoupler
- onsemi MC7805BD2TG 5V 1A Positive Voltage Regulator LDO Datasheet and Application Circuit
- onsemi MC74AC373DWR2G Octal Transparent Latch with 3-State Outputs
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- DDR2 Prices Soar 60% as AI Hungers Consume Legacy DRAM – Full-Category Memory Rally Intensifies
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- Micron Q3 FY2026 Revenue Hits $41.46B, AI Memory Demand Drives 1,398% Net Income Surge
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- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Samsung Pushes DSEP Platform, Targets Fully Automated Wafer Fab by 2030
- onsemi Appoints He Maojun as China VP and GM for System Products
- Top‑10 Foundries Post Record Q1 Revenue – TSMC at 72% Share, Nexchip Jumps to #8
- Hanmi Semiconductor Invests ₩50B in SpaceX Ahead of Its $1.77T Nasdaq Debut
- SK Hynix to Mass‑Produce 375‑Layer 3D NAND by Year‑End, Switches to Molybdenum for Word Lines
- Nikon Develops New Digital Lithography Tool for Advanced Packaging: 30% Higher Throughput<
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- Diodes Expands AH371xQ Automotive Hall Latch Family for BLDC Motor Sensing
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- TSMC CEO Wei: Nanjing Fab Has No Risk, $56B CapEx for 2026, ‘Wish Elon Well’ on His Fab
- Q1 2026 DRAM Revenue Surges 81% to $97B, Contract Prices Nearly Double
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Lightmatter Joins Nvidia NVLink Fusion Ecosystem to Power AI Optical Interconnects
- NXP TJA1054AT/S900: High-Performance CAN Bus Transceiver for Automotive Networking Applications
- NXP UJA1132HW/FD/3V/0Y: A Comprehensive Technical Overview of the System Basis Chip for Automotive Networks
- NXP 74LVC373APW: A Comprehensive Technical Overview of the 3V Octal D-Type Transparent Latch
- Anthropic Confidentially Files for IPO at $965B Valuation, Outpacing OpenAI
- NXP UAA3546HN/C4: A Comprehensive Technical Overview of the Advanced PLL Frequency Synthesizer
- NXP UJA1168TK/VX/FDJ: A Comprehensive System Basis Chip for Next-Generation Automotive Networks
- NXP 74LVC04ADB Hex Inverter: Key Features, Applications, and Technical Overview
- NXP TL431AMSDT: A Comprehensive Technical Overview of the Adjustable Precision Shunt Regulator
- NXP TJA1059TK/S1: A High-Performance CAN Transceiver for Robust Automotive Networking
- Samsung Overtakes Micron as No.1 in Global Automotive Memory Market
- China Big Fund Trims Stakes in NSIG, Debang, SMIC – Market Reaction Muted
- Tencent’s Canghai V1 Tops MSU Hardware Encoding Contest; V2 Set for H2 2026 Mass Production
- Guangdong Guangbao Microelectronics Faces Bankruptcy Over Unpaid Debts
- The PCF85063BTL/1: NXP's Ultra-Low-Power Real-Time Clock for Precision Timing in Space-Constrained Designs
- NXP PSMN1R2-30YLD: A Deep Dive into its 30 V, 2 mΩ Power MOSFET Technology
- NXP PDTC114EK: A Comprehensive Technical Overview of the NPN Digital Transistor
- NXP PBHV8140Z,115: A Comprehensive Technical Overview of the High-Voltage PNP Transistor
- NXP TEA1522T: A Low-Power Off-Line Switcher IC for Cost-Effective SMPS Designs
- PCF8533U/2/F2: NXP's Advanced Universal LCD Driver for Low-Multiplex Displays
- The NXP PCF8574T/3518: A Comprehensive Guide to the Remote 8-Bit I/O Expander for I2C-Bus Applications
- NXP P89V51RD2BN: An In-Depth Technical Overview of the 80C51 Microcontroller
- Sensirion Launches STC42A Automotive Hydrogen Sensor for Battery Thermal Runaway Detection
- Asia’s March Chip Exports Surge 81% as AI Demand Drives Unprecedented Price-Volume Gap
- SiTime Elite 2 Super-TCXO Cuts AI Cluster Sync to Sub‑1ns, Boosts GPU Utilization
- TSMC’s Japan Fab JASM Turns Profitable for First Time in Q1 2026
- NXP LPC11E67JBD48: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- NXP LPC1317FBD48: A Comprehensive Technical Overview of the ARM Cortex-M3 Microcontroller
- NXP MCIMX6U1AVM08ACR: A Comprehensive Technical Overview of the i.MX 6UltraLite Applications Processor
- NXP MFRC52302HN1,151: A Comprehensive Technical Overview and Application Guide for the Contactless Reader IC
- NXP 74LVC4245A: A Comprehensive Guide to the 8-Bit Dual-Supply Bidirectional Voltage Level Translator
- NXP 74LVT162245BDGG: 16-Bit Dual Supply Translating Transceiver with 3-State Outputs
- SMIC Q1 Sales Hit $2.505B, Gross Margin Rises to 20.1% on Pricing Power